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1. 
Inventor: David D C Chang { }

Assignee: AT&T Corp { }

Attorney: Roderick B Anderson; Kenneth M Brown

Title: Electrical test apparatus and method
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5500605    Publication date : 1996-03-19
Referenced by: 112    Reference cited: 10   
    
2. 
Inventor: Salman Akram { }
Assignee: Micron Technology, Inc { }
Title: Method of fabricating a multi-chip module
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6214641    Publication date : 2001-04-10
Referenced by: 100    Reference cited: 13   
    
3. 
Inventor: Richard Allan Deckert { }; Steven Engelking { }; Joey Dean Evans { }
Assignee: Sony Electronics Inc { }
Title: Integrated testing method and apparatus for semiconductor testoperations processing
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6137303    Publication date : 2000-10-24
Referenced by: 96    Reference cited: 4   
    
4. 
Inventor: Lau James C K; Malmgren Richard P; Lui Kenneth
Assignee: TRW Inc
Title: Testing device for integrated circuits on wafer
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5479109    Publication date : 1995-12-26
Referenced by: 95    Reference cited: 22   
    
5. 
Inventor: Nolan Charles C; Sahr Stuart
Assignee: Signatone Corporation
Attorney: Castle Linval B
Title: Temperature conditioner for tests of unpackaged semiconductors
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 4845426    Publication date : 1989-07-04
Referenced by: 93    Reference cited: 2   
    
6. 
Inventor: Jerrold L King { }; Leland R Nevill { }
Assignee: Micron Technology, Inc { }
Title: Semiconductor chip package
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6198172    Publication date : 2001-03-06
Referenced by: 82    Reference cited: 3   
    
7. 
Inventor: Luen-Chian Sun { }
Assignee: Taiwan Semiconductor Manufacturing Co, Ltd { }
Title: Probing of device elements
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6902941    Publication date : 2005-06-07
Referenced by: 81    Reference cited: 6   
    
8. 
Inventor: Clarke Norman B; Cook Lawrence G; Doyle Robert G; Renner Michael
Assignee: International Business Machines Corporation
Attorney: Whitham & Marhoefer
Title: Molded test probe assembly
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5334931    Publication date : 1994-08-02
Referenced by: 80    Reference cited: 16   
    
9. 
Inventor: Kong Alvin M; Lau James C; Chan Steven S
Assignee: TRW Inc
Title: Mass simultaneous sealing and electrical connection of electronic devices
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 5448014    Publication date : 1995-09-05
Referenced by: 74    Reference cited: 12   
    
10. 
Inventor: Keith E Barrett { }
Assignee: Micron Technology, Inc { }
Title: Test interposer for use with ball grid array packages assemblies andball grid array packages including same and methods
Patent Office: United States of America Patent and Trademark Office. Granted Patents (USPTO)    Document Number: 6081429    Publication date : 2000-06-27
Referenced by: 72    Reference cited: 20   
    
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